In SENSE you can automatically build the 3D stackup of your capacitive touch sensor by using the StackUp option. 

The StackUp option consists of the STACKUP tab and the VIAS tab, each with a unique functionality.

Here is the place where you can add materials in the library oF SENSE in order to test their performance, here is where you define how thin/thick your cover frame and substrates can be but also here is the place where you can test the performance of your layouts design against different technologies (GFF, OGS, On-Cell etc.)

Finally, here is the place where you can electrically connect two layers of conductive parts in different position in the StackUp (one on top of the other) by using VIAS bridges

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